View TC1072_1408096.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

? 2002 microchip technology inc. ds21354b-page 1 TC1072/tc1073 features ? zero ground current for longer battery life very low dropout voltage choice of 50ma (TC1072) and 100ma (tc1073) output high output voltage accuracy standard or custom output voltages power-saving shutdown mode error output can be used as a low battery detector or processor reset generator bypass input for ultra quiet operation over current and over temperature protection space-saving 6-pin sot-23a package pin compatible upgrades for bipolar regulators applications battery operated systems portable computers medical instruments instrumentation cellular/gsm/phs phones linear post-regulators for smps ? pagers device selection table note: xx indicates output voltages available output voltages: 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.6, 4.0, 5.0. other output voltages are available. please contact microchip technology inc. for details. package type part number package junction temp. range TC1072-xxvch 6-pin sot-23a -40c to +125c tc1073-xxvch 6-pin sot-23a -40c to +125c shdn 6 6-pin sot-23a TC1072 tc1073 13 4 2 v in v out gnd bypass 5 error note: 6-pin sot-23a is equivalent to the eiaj (sc-74a) 50ma and 100ma cmos ldos with shutdown, error output and v ref bypass
TC1072/tc1073 ds21354b-page 2 ? 2002 microchip technology inc. general description the TC1072 and tc1073 are high accuracy (typically 0.5%) cmos upgrades for older (bipolar) low dropout regulators. designed specifically for battery-operated systems, the devices? cmos construction eliminates wasted ground current, significantly extending battery life. total supply current is typically 50 a at full load (20 to 60 times lower than in bipolar regulators). the devices? key features include ultra low noise operation (plus optional bypass input); very low dropout voltage (typically 85mv, TC1072 and 180mv, tc1073 at full load) and fast response to step changes in load. an error output (error ) is asserted when the devices are out-of-regulation (due to a low input voltage or excessive output current). error can be used as a low battery warning or as a processor reset signal (with the addition of an external rc network). supply current is reduced to 0.5 a(max)and both v out and error are disabled when the shutdown input is low. the devices incorporate both over-temperature and over-current protection. the TC1072 and tc1073 are stable with an output capacitor of only 1 f and have a maximum output current of 50ma, and 100ma respectively. for higher output current versions, please see the tc1185, tc1186, tc1187 (i out = 150ma) and tc1107, tc1108 and tc1173 (i out = 300ma) data sheets. typical application TC1072 tc1073 v out gnd 1 f + v in v in v out 1 6 2 4 3 shdn shutdown control (from power control logic) error error bypass c bypass 470pf 5 r p
? 2002 microchip technology inc. ds21354b-page 3 TC1072/tc1073 1.0 electrical characteristics absolute maximum ratings* input voltage......................................................... 6.5v output voltage ...........................(-0.3v) to (v in +0.3v) power dissipation ............... internally limited (note 6) maximum voltage on any pin ........ v in +0.3v to -0.3v operating temperature range ......-40c < t j < 125c storage temperature ......................... -65c to +150c *stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. TC1072/tc1073 electrical specifications electrical characteristics: v in =v out +1v,i l =0.1ma,c l =3.3 f, shdn >v ih ,t a = 25c, unless otherwise noted. boldface type specifications apply for junction temperatures of -40c to +125c. symbol parameter min typ max units test conditions v in input operating voltage 2.7 ? 6.0 v note 9 i out max maximum output current 50 100 ? ? ? ? ma ma TC1072 tc1073 v out output voltage v r ?2.5% v r 0.5% v r +2.5% v note 1 tcv out v out temperature coefficient ? ? 20 40 ? ? ppm/c note 2 ? v out / ? v in line regulation ? 0.05 0.35 %(v r +1v) v in 6v ? v out /v out load regulation ? 0.5 2.0 %i l = 0.1ma to i out max (note 3) v in -v out dropout voltage ? ? ? ? 2 65 85 180 ? ? 120 250 mv i l =0.1ma i l =20ma i l =50ma i l =100ma (note 4) ,tc1073 i in supply current ? 50 80 a shdn =v ih ,i l =0 (note 8) i insd shutdown supply current ? 0.05 0.5 a shdn =0v psrr power supply rejection ratio ? 64 ? db f re 1khz i out sc output short circuit current ? 300 450 ma v out =0v ? v out / ? p d thermal regulation ? 0.04 ? v/w notes 5, 6 t sd thermal shutdown die temperature ? 160 ? c ? t sd thermal shutdown hysteresis ? 10 ? c en output noise ? 260 ? nv/ hz i l =i out max 470pf from bypass to gnd shdn input v ih shdn input high threshold 45 ? ? %v in v in =2.5vto6.5v v il shdn input low threshold ? ? 15 %v in v in =2.5vto6.5v note 1: v r is the regulator output voltage setting. for example: v r = 2.5v, 2.7v, 2.85v, 3.0v, 3.3v, 3.6v, 4.0v, 5.0v. 2: 3: regulation is measured at a constant junction temperature using low duty cycle pulse testing. load regulation is tested over a load range from 0.1ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. specifications are for a current pulse equal to i l max at v in = 6v for t = 10 msec. 6: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., t a ,t j , ja ). exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. please see section 4.0 thermal considerations for more details. 7: hysteresis voltage is referenced by v r . 8: apply for junction temperatures of -40c to +85c. 9: the minimum v in has to justify the conditions = v in v r +v dropout and v in 2.7v for i l = 0.1ma to i out max . tc v out =(v out max ?v out min )x10 6 v out x ? t
TC1072/tc1073 ds21354b-page 4 ? 2002 microchip technology inc. TC1072/tc1073 electrical specifications (continued) electrical characteristics: v in =v out +1v,i l =0.1ma,c l =3.3 f, shdn >v ih ,t a = 25c, unless otherwise noted. boldface type specifications apply for junction temperatures of -40c to +125c. symbol parameter min typ max units test conditions error open drain output v in min minimum v in operating voltage 1.0 ? ? v v ol output logic low voltage ? ? 400 mv 1 ma flows to error v th error threshold voltage ? 0.95 x v r ? v seefigure3-2 v hys error positive hysteresis ? 50 ? mv note 7 note 1: v r is the regulator output voltage setting. for example: v r = 2.5v, 2.7v, 2.85v, 3.0v, 3.3v, 3.6v, 4.0v, 5.0v. 2: 3: regulation is measured at a constant junction temperature using low duty cycle pulse testing. load regulation is tested over a load range from 0.1ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. specifications are for a current pulse equal to i l max at v in = 6v for t = 10 msec. 6: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., t a ,t j , ja ). exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. please see section 4.0 thermal considerations for more details. 7: hysteresis voltage is referenced by v r . 8: apply for junction temperatures of -40c to +85c. 9: the minimum v in has to justify the conditions = v in v r +v dropout and v in 2.7v for i l =0.1matoi out max . tc v out =(v out max ?v out min )x10 6 v out x ? t
? 2002 microchip technology inc. ds21354b-page 5 TC1072/tc1073 2.0 pin descriptions the descriptions of the pins are listed in table 2-1. table 2-1: pin function table pin no. (6-pin sot-23a) symbol description 1v in unregulated supply input. 2 gnd ground terminal. 3 shdn shutdown control input. the regulator is fully enabled when a logic high is applied to this input. the regulator enters shutdown when a logic low is applied to this input. during shutdown, output voltage falls to zero and supply current is reduced to 0.05 a(typical). 4 error out-of-regulation flag. (open drain output). this output goes low when v out is out-of- tolerance by approximately ? 5%. 5 bypass reference bypass input. connecting a 470pf to this input further reduces output noise. 6v out regulated voltage output.
TC1072/tc1073 ds21354b-page 6 ? 2002 microchip technology inc. 3.0 detailed description the TC1072 and tc1073 are precision fixed output voltage regulators. (if an adjustable version is desired, please see the tc1070/tc1071/tc1187 data sheet.) unlike bipolar regulators, the TC1072 and tc1073?s supply current does not increase with load current. in addition, v out remains stable and within regulation over the entire 0ma to i out max load current range, (an important consideration in rtc and cmos ram battery back-up applications). figure 3-1 shows a typical application circuit. the regulator is enabled any time the shutdown input (shdn )isatorabovev ih , and shutdown (disabled) when shdn is at or below v il . shdn may be controlled by a cmos logic gate, or i/o port of a microcontroller. if the shdn input is not required, it should be connected directly to the input supply. while in shutdown, supply current decreases to 0.05 a (typical), v out falls to zero volts, and error is open- circuited. figure 3-1: typical application circuit 3.1 error open drain output error is driven low whenever v out falls out of regulation by more than ? 5% (typical). this condition may be caused by low input voltage, output current limiting, or thermal limiting. the error output voltage value (e.g. error =v ol at 4.75v (typ.) for a 5.0v regulator and 2.85v (typ.) for a 3.0v regulator). error output operation is shown in figure 3-2. note that error is active when v out falls to v th ,and inactive when v out rises above v th by v hys . as shown in figure 3-1, error canbeusedasa battery low flag, or as a processor reset signal (with the addition of timing capacitor c2). r1 x c2 should be chosen to maintain error below v ih of the processor reset input for at least 200 msec to allow time for the system to stabilize. pull-up resistor r1 can be tied to v out ,v in or any other voltage less than (v in +0.3v). figure 3-2: error output operation 3.2 output capacitor a1 f(min)capacitorfromv out to ground is recommended. the output capacitor should have an effective series resistance greater than 0.1 ? and less than 5.0 ? , and a resonant frequency above 1mhz. a 1 f capacitor should be connected from v in to gnd if there is more than 10 inches of wire between the regulator and the ac filter capacitor, or if a battery is used as the power source. aluminum electrolytic or tantalum capacitor types can be used. (since many aluminum electrolytic capacitors freeze at approxi- mately -30c, solid tantalums are recommended for applications operating below -25c.) when operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 3.3 bypass input a 470pf capacitor connected from the bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. if output noise is not a concern, this input may be left unconnected. larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. TC1072 tc1073 v out shdn gnd error 1 f c1 + v in v out shutdown control (to cmos logic or tie to v in if unused) 1 f + battery + 0.2 f c2 c2 required only if error is used as a processor reset signal (see text) r1 1m v+ battlow or reset bypass c3, 470pf v th v out error v ih v ol hysteresis (v h )
? 2002 microchip technology inc. ds21354b-page 7 TC1072/tc1073 4.0 thermal considerations 4.1 thermal shutdown integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160c. the regulator remains off until the die temperature drops to approximately 150c. 4.2 power dissipation the amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. the following equation is used to calculate worst case actual power dissipation: equation 4-1: the maximum allowable power dissipation (equation 4-2) is a function of the maximum ambient temperature (t a max ), the maximum allowable die temperature (t j max ) and the thermal resistance from junction-to-air ( ja ). the 6-pin sot-23a package has a ja of approximately 220c/watt. equation 4-2: equation 4-1 can be used in conjunction with equation 4-2 to ensure regulator thermal operation is within limits. for example: given: v in max =3.0v5% v out min =2.7v?2.5% i load max =40ma t j max = 125c t a max =55c find: 1. actual power dissipation 2. maximum allowable dissipation actual power dissipation: p d (v in max ?v out min )i load max = [(3.0 x 1.05) ? (2.7 x .975)]40 x 10 ?3 = 20.7mw maximum allowable power dissipation: in this example, the TC1072 dissipates a maximum of 20.7mw; below the allowable limit of 318mw. in a similar manner, equation 4-1 and equation 4-2 can be used to calculate maximum current and/or input voltage limits. 4.3 layout considerations the primary path of heat conduction out of the package is via the package leads. therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower ja and therefore increase the maximum allowable power dissipation limit. where: p d (v in max ?v out min )i load max p d v in max v out min i load max = worst case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p d max =(t j max ?t a max ) ja where all terms are previously defined. p d max =(t j max ?t a max ) ja = (125 ? 55) 220 = 318mw
TC1072/tc1073 ds21354b-page 8 ? 2002 microchip technology inc. 5.0 typical characteristics (unless otherwise specified, all parts are measured at temperature = 25c) note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.000 0.002 0.004 0.006 0.008 0.010 0.012 0.014 0.016 0.018 0.020 -40 -20 0 20 50 70 125 dropout voltage (v) i load = 10ma c in = 1 f c out = 1 f temperature ( c) dropout voltage vs. temperature (v out = 3.3v) 0.000 0.020 0.040 0.060 0.080 0.100 0.120 0.140 0.160 0.180 0.200 -40 -20 0 20 50 70 125 dropout voltage (v) i load = 100ma c in = 1 f c out = 1 f temperature ( c) dropout voltage vs. temperature (v out = 3.3v) 0 10 20 30 40 50 60 70 80 90 gnd current ( a) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 i load = 10ma c in = 1 f c out = 1 f ground current vs. v in (v out = 3.3v) v in (v) 0.000 0.010 0.020 0.030 0.040 0.050 0.060 0.070 0.080 0.090 0.100 -40 -20 0 20 50 70 125 dropout voltage (v) i load = 50ma c in = 1 f c out = 1 f temperature ( c) dropout voltage vs. temperature (v out = 3.3v) 0.000 0.050 0.100 0.150 0.200 0.250 0.300 -40 -20 0 20 50 70 125 dropout voltage (v) i load = 150ma c in = 1 f c out = 1 f temperature ( c) dropout voltage vs. temperature (v out = 3.3v) 0 10 20 30 40 50 60 70 80 90 gnd current ( a) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 i load = 100ma c in = 1 f c out = 1 f ground current vs. v in (v out = 3.3v) v in (v)
? 2002 microchip technology inc. ds21354b-page 9 TC1072/tc1073 5.0 typical characteristics (continued) (unless otherwise specified, all parts are measured at temperature = 25c) 0 10 20 30 40 50 60 70 80 gnd current ( a) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 i load = 150ma c in = 1 f c out = 1 f v in (v) ground current vs. v in (v out = 3.3v) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i load = 100ma c in = 1 f c out = 1 f 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 v in (v) v out (v) v out vs. v in (v out = 3.3v) 3.274 3.276 3.278 3.280 3.282 3.284 3.286 3.288 3.290 -40 -20 -10 0 20 40 85 125 i load = 150ma c in = 1 f c out = 1 f v in = 4.3v temperature ( c) v out (v) output voltage vs. temperature (v out = 3.3v) 0 0.5 1 1.5 2 2.5 3 3.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 i load = 0 c in = 1 f c out = 1 f v in (v) v out (v) v out vs. v in (v out = 3.3v) 3.275 3.280 3.285 3.290 3.295 3.300 3.305 3.310 3.315 3.320 -40 -20 -10 0 20 40 85 125 i load = 10ma c in = 1 f c out = 1 f v in = 4.3v temperature ( c) v out (v) output voltage vs. temperature (v out = 3.3v)
TC1072/tc1073 ds21354b-page 10 ? 2002 microchip technology inc. 5.0 typical characteristics (continued) (unless otherwise specified, all parts are measured at temperature = 25c) 4.985 4.990 4.995 5.000 5.005 5.010 5.015 5.020 5.025 -40 -20 -10 0 20 40 85 125 i load = 10ma v in = 6v c in = 1 f c out = 1 f temperature ( c) output voltage vs. temperature (v out = 5v) v out (v) 0 10 20 30 40 50 60 70 -40 -20 -10 0 20 40 85 125 gnd current ( a) i load = 10ma v in = 6v c in = 1 f c out = 1 f temperature ( c) temperature vs. quiescent current (v out = 5v) 4.974 4.976 4.978 4.980 4.982 4.984 4.986 4.988 4.990 4.992 4.994 -40 -20 -10 0 20 40 85 125 i load = 150ma v in = 6v c in = 1 f c out = 1 f temperature ( c) output voltage vs. temperature (v out = 5v) v out (v) temperature vs. quiescent current (v out = 5v) 0 10 20 30 40 50 60 70 80 -40 -20 -10 0 20 40 85 125 gnd current ( a) i load = 150ma v in = 6v c in = 1 f c out = 1 f temperature ( c) 10.0 1.0 0.1 0.0 0.01k 0.1k 1k 10k 100k 1000k frequency (hz) output noise vs. frequency noise ( v/ hz) r load = 50 ? c out = 1 f c in = 1 f c byp = 0 1000 100 10 1 0.1 0.01 0 10 20 30 40 50 60 70 80 90 100 load current (ma) stability region vs. load current c out esr ( ? ) c out = 1 f to 10 f stable region s table re g io n -30 -35 -40 -45 -50 -60 -55 -65 -70 -75 -80 0.01k 0.1k 1k 10k 100k 1000 k frequency (hz) power supply rejection ratio psrr (db) i out = 10ma v in dc = 4v v in ac = 100mv p-p v out = 3v c in = 0 c out = 1 f
? 2002 microchip technology inc. ds21354b-page 11 TC1072/tc1073 5.0 typical characteristics (continued) v out measure rise time of 3.3v ldo with bypass capacitor conditions: c in = 1 f, c out = 1 f, c byp = 470pf, i load = 100ma v in = 4.3v, temp = 25 c, rise time = 448 s v shdn measure fall time of 3.3v ldo with bypass capacitor conditions: c in = 1 f, c out = 1 f, c byp = 470pf, i load = 50ma v in = 4.3v, temp = 25 c, fall time = 100 s v out v shdn measure rise time of 3.3v ldo without bypass capacitor conditions: c in = 1 f, c out = 1 f, c byp = 0pf, i load = 100ma v in = 4.3v, temp = 25 c, rise time = 184 s v out v shdn measure fall time of 3.3v ldo without bypass capacitor conditions: c in = 1 f, c out = 1 f, c byp = 0pf, i load = 100ma v in = 4.3v, temp = 25 c, fall time = 52 s v out v shdn
TC1072/tc1073 ds21354b-page 12 ? 2002 microchip technology inc. 5.0 typical characteristics (continued) measure rise time of 5.0v ldo with bypass capacitor conditions: c in = 1 f, c out = 1 f, c byp = 470pf, i load = 100ma v in = 6v, temp = 25 c, rise time = 390 s v out v shdn measure fall time of 5.0v ldo with bypass capacitor conditions: c in = 1 f, c out = 1 f, c byp = 470pf, i load = 50ma v in = 6v, temp = 25 c, fall time = 167 s v out v shdn measure rise time of 5.0v ldo without bypass capacitor conditions: c in = 1 f, c out = 1 f, c byp = 0pf, i load = 100ma v in = 6v, temp = 25 c, rise time = 192 s v out v shdn measure fall time of 5.0v ldo without bypass capacitor conditions: c in = 1 f, c out = 1 f, c byp = 0pf, i load = 100ma v in = 6v, temp = 25 c, fall time = 88 s v out v shdn
? 2002 microchip technology inc. ds21354b-page 13 TC1072/tc1073 5.0 typical characteristics (continued) i load v out load regulation of 3.3v ldo conditions: c in = 1 f, c out = 2.2 f, c byp = 470pf, v in = v out + 0.25v, temp = 25 c i load = 50ma switched in at 10khz, v out is ac coupled load regulation of 3.3v ldo conditions: c in = 1 f, c out = 2.2 f, c byp = 470pf, v in = v out + 0.25v, temp = 25 c i load = 150ma switched in at 10khz, v out is ac coupled i load v out load regulation of 3.3v ldo conditions: c in = 1 f, c out = 2.2 f, c byp = 470pf, v in = v out + 0.25v, temp = 25 c i load = 100ma switched in at 10khz, v out is ac coupled i load v out v in v out line regulation of 3.3v ldo conditions: v in = 4v, + 1v squarewave @ 2.5khz c in = 0 f, c out = 1 f, c byp = 470pf, i load = 100ma, v in & v out are ac coupled
TC1072/tc1073 ds21354b-page 14 ? 2002 microchip technology inc. 5.0 typical characteristics (continued) line regulation of 5.0v ldo conditions: v in = 6v, + 1v squarewave @ 2.5khz v in v out c in = 0 f, c out = 1 f, c byp = 470pf, i load = 100ma, v in & v out are ac coupled v out thermal shutdown response of 5.0v ldo conditions: v in = 6v, c in = 0 f, c out = 1 f i load was increased until temperature of die reached about 160 c, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160 c. the regulator remains off until die temperature drops to approximately 150 c.
? 2002 microchip technology inc. ds21354b-page 15 TC1072/tc1073 6.0 packaging information 6.1 package marking information ?1? & ?2? = part number code + temperature range and voltage ?3? represents year and quarter code ?4? represents lot id number 6.2 taping form (v) TC1072 code tc1073 code 2.5 e1 f1 2.7 e2 f2 2.8 ez fz 2.85 e8 f8 3.0 e3 f3 3.3 e5 f5 3.6 e9 f9 4.0 e0 f0 5.0 e7 f7 component taping orientation for 6-pin sot-23a (eiaj sc-74) devices package carrier width (w) pitch (p) part per full reel reel size 6-pin sot-23a 8 mm 4 mm 3000 7 in carrier tape, number of components per reel and reel size standard reel component orientation for tr suffix device (mark right side up) user direction of feed device marking pin 1 device marking device marking device marking device marking device marking device marking device marking device marking device marking device marking device marking device marking w p
TC1072/tc1073 ds21354b-page 16 ? 2002 microchip technology inc. 6.3 package dimensions .069 (1.75) .059 (1.50) .122 (3.10) .098 (2.50) .075 (1.90) ref. .020 (0.50) .014 (0.35) .037 (0.95) ref. .118 (3.00) .110 (2.80) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .024 (0.60) .004 (0.10) 10 max. .008 (0.20) .004 (0.09) sot-23a-6 dimensions: inches (mm)
? 2002 microchip technology inc. ds21354b-page 17 TC1072/tc1073 sales and support data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1072/tc1073 ds21354b-page 18 ? 2002 microchip technology inc. notes:
? 2002 microchip technology inc. ds21354b-page 19 TC1072/tc1073 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip?s products as critical com- ponents in life support systems is not authorized except with express written approval by microchip. no licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, filterlab, k ee l oq ,microid, mplab,pic,picmicro,picmaster, picstart, pro mate, seeval and the embedded control solutions company are registered trademarks of microchip tech- nology incorporated in the u.s.a. and other countries. dspic, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, microport, migratable memory, mpasm, mplib, mplink, mpsim, mxdev, mxlab, picc, picdem, picdem.net, rfpic, select mode and total endurance are trademarks of microchip technology incorporated in the u.s.a. serialized quick turn programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2002, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999 and mountain view, california in march 2002. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, non-volatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001 certified.
ds21354b-page 20 ? 2002 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: 480-792-7627 web address: http://www.microchip.com rocky mountain 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7966 fax: 480-792-7456 atlanta 500 sugar mill road, suite 200b atlanta, ga 30350 tel: 770-640-0034 fax: 770-640-0307 boston 2 lan drive, suite 120 westford, ma 01886 tel: 978-692-3848 fax: 978-692-3821 chicago 333 pierce road, suite 180 itasca, il 60143 tel: 630-285-0071 fax: 630-285-0075 dallas 4570 westgrove drive, suite 160 addison, tx 75001 tel: 972-818-7423 fax: 972-818-2924 detroit tri-atria office building 32255 northwestern highway, suite 190 farmington hills, mi 48334 tel: 248-538-2250 fax: 248-538-2260 kokomo 2767 s. albright road kokomo, indiana 46902 tel: 765-864-8360 fax: 765-864-8387 los angeles 18201 von karman, suite 1090 irvine, ca 92612 tel: 949-263-1888 fax: 949-263-1338 new york 150 motor parkway, suite 202 hauppauge, ny 11788 tel: 631-273-5305 fax: 631-273-5335 san jose microchip technology inc. 2107 north first street, suite 590 san jose, ca 95131 tel: 408-436-7950 fax: 408-436-7955 toronto 6285 northam drive, suite 108 mississauga, ontario l4v 1x5, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific australia microchip technology australia pty ltd suite 22, 41 rawson street epping 2121, nsw australia tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing microchip technology consulting (shanghai) co., ltd., beijing liaison office unit 915 bei hai wan tai bldg. no. 6 chaoyangmen beidajie beijing, 100027, no. china tel: 86-10-85282100 fax: 86-10-85282104 china - chengdu microchip technology consulting (shanghai) co., ltd., chengdu liaison office rm. 2401, 24th floor, ming xing financial tower no. 88 tidu street chengdu 610016, china tel: 86-28-86766200 fax: 86-28-86766599 china - fuzhou microchip technology consulting (shanghai) co., ltd., fuzhou liaison office unit 28f, world trade plaza no. 71 wusi road fuzhou 350001, china tel: 86-591-7503506 fax: 86-591-7503521 china - shanghai microchip technology consulting (shanghai) co., ltd. room 701, bldg. b far east international plaza no. 317 xian xia road shanghai, 200051 tel: 86-21-6275-5700 fax: 86-21-6275-5060 china - shenzhen microchip technology consulting (shanghai) co., ltd., shenzhen liaison office rm. 1315, 13/f, shenzhen kerry centre, renminnan lu shenzhen 518001, china tel: 86-755-2350361 fax: 86-755-2366086 china - hong kong sar microchip technology hongkong ltd. unit 901-6, tower 2, metroplaza 223 hing fong road kwai fong, n.t., hong kong tel: 852-2401-1200 fax: 852-2401-3431 india microchip technology inc. india liaison office divyasree chambers 1 floor, wing a (a3/a4) no. 11, o?shaugnessey road bangalore, 560 025, india tel: 91-80-2290061 fax: 91-80-2290062 japan microchip technology japan k.k. benex s-1 6f 3-18-20, shinyokohama kohoku-ku, yokohama-shi kanagawa, 222-0033, japan tel: 81-45-471- 6166 fax: 81-45-471-6122 korea microchip technology korea 168-1, youngbo bldg. 3 floor samsung-dong, kangnam-ku seoul, korea 135-882 tel: 82-2-554-7200 fax: 82-2-558-5934 singapore microchip technology singapore pte ltd. 200 middle road #07-02 prime centre singapore, 188980 tel: 65-6334-8870 fax: 65-6334-8850 ta iw a n microchip technology taiwan 11f-3, no. 207 tung hua north road taipei, 105, taiwan tel: 886-2-2717-7175 fax: 886-2-2545-0139 europe denmark microchip technology nordic aps regus business centre lautrup hoj 1-3 ballerup dk-2750 denmark tel: 45 4420 9895 fax: 45 4420 9910 france microchip technology sarl parc d?activite du moulin de massy 43 rue du saule trapu batiment a - ler etage 91300 massy, france tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany microchip technology gmbh gustav-heinemann ring 125 d-81739 munich, germany tel: 49-89-627-144 0 fax: 49-89-627-144-44 italy microchip technology srl centro direzionale colleoni palazzo taurus 1 v. le colleoni 1 20041 agrate brianza milan, italy tel: 39-039-65791-1 fax: 39-039-6899883 united kingdom microchip ltd. 505 eskdale road winnersh triangle wokingham berkshire, england rg41 5tu tel: 44 118 921 5869 fax: 44-118 921-5820 05/01/02 *ds21354b* w orldwide s ales and s ervice

▲Up To Search▲

Price & Availability of TC1072

	To Download TC1072 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .